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Main specifications and parameters of MOS field effect tube

Date:2022-03-01 16:38:00

MOS transistor, also known as field effect transistor, is a common power device in the circuit. According to the material structure, it is divided into two types: n-channel MOS tube and p-channel MOS tube. The letter of FET represents the material, D is p-type silicon, and the inversion layer is n-channel; C is the n-type silicon p-channel. For example, 3dj6d is a junction type p-channel field effect transistor, and 3do6c is an insulated gate type n-channel field effect transistor. The following describes the MOS FET parameter comparison table and main specifications. View >>

Welding knowledge: reflow technical index and defect analysis and treatment

Date:2022-02-28 15:21:45

Reflow soldering is to realize the mechanical and electrical connection between the solder end or pin of surface assembled components and the PCB pad by remelting the paste solder pre allocated to the PCB pad. Reflow soldering technology is no stranger in the field of electronic manufacturing. The components on various boards and cards used in our computer are welded to the circuit board through this process. There is a heating circuit inside the equipment, which heats the air or nitrogen to a sufficiently high temperature and blows it to the circuit board with the components pasted, so that the solder on both sides of the components melts and bonds with the main board. Next, let's introduce the technical indicators and defect analysis of circuit board reflow soldering. Let's have a look. View >>

How to deal with chip failure analysis? Third party testing unit

Date:2022-02-28 14:43:00

Failure analysis is a necessary means to determine the failure mechanism of chip, which provides necessary information for effective fault diagnosis. Failure analysis provides necessary feedback information for design engineers to continuously improve or repair the chip design and make it more consistent with the design specification. With the continuous improvement of people's requirements for product quality and reliability, failure analysis is becoming more and more important. How to deal with chip failure analysis? Sort out relevant data as follows: View >>

X-ray nondestructive testing is used for casting quality inspection

Date:2022-02-28 14:22:00

Casting is one of the basic processes of modern machinery manufacturing industry. It has the advantages of low cost, one-time forming and can manufacture large parts with complex structure. It is widely used in many fields of industrial production, such as automobile parts, machinery manufacturing, electronics, medical devices, clocks and watches, hardware products, aviation and aerospace. X-ray nondestructive testing has become the main method of casting defect detection because it can avoid material waste and improve production efficiency. View >>

Inspection methods and standard specifications in welded workpieces

Date:2022-02-28 13:38:00

The welding method is usually selected according to the following principles. The selected welding method must ensure the welding quality and meet the technical requirements of product design; At the same time, it can improve the welding production efficiency, reduce the manufacturing cost and improve the working conditions. According to the heating degree and process characteristics of the welding process, the welding methods can be divided into three categories. View >>

Reliability test type report standard and process report

Date:2022-02-25 13:51:16

Reliability is an important quality index. By using various environmental test equipment to simulate various changes in the climate environment, accelerate the reaction of the product in the service environment, and verify whether it meets the expected quality standards in R & D, design and manufacturing. So as to evaluate the whole product to determine the reliability function of the product and the ability or possibility of the product to perform the specified function without failure in a certain time or condition. This paper has collected and sorted out some materials, and I hope this paper can be of great reference value to all readers. View >>

PCB failure detection and application of electronic component failure analysis technology

Date:2022-02-25 13:38:39

As we all know, product failure will cause serious economic losses and quality impact. However, PCB failure modes are diverse and the root causes of failure are also different. The main material of PCB is the composite of glass fiber and epoxy resin, which is divided into single panel, double-sided board and multilayer board. Therefore, how to quickly locate the root cause of PCB failure and optimize and improve the performance of products has become the focus of PCB industry. View >>

What is selective welding? Introduction to technical features and process flow

Date:2022-02-24 17:21:00

What is selective welding? Selective welding is one of the processes used in the manufacture of various electronic components (usually circuit boards). Typically, the process involves welding specific electronic components to a printed circuit board without affecting other areas of the circuit board. This is different from various reflow processes, exposing the entire circuit board to molten solder. In fact, selective welding can refer to any welding method, from manual welding to special welding equipment, as long as the method is accurate enough to use solder only in the required area. View >>

Main items and handling process of power supply reliability test

Date:2022-02-24 17:16:54

The power module is a kind of power converter, which can be directly welded and inserted into the circuit board. As the power source for the survival of modern science and technology, it has become one of the most critical components. The reliability of power supply will affect the reliability of equipment to a great extent. Therefore, the reliability test of power supply has become the premise of all parameters and performance guarantee. What are the reliability test items of power module? View >>

Conventional methods and ideas of failure analysis

Date:2022-02-23 16:54:13

Failure refers to the failure of electronic components. The important components of various electronic systems or electronic circuits are generally different types of components. When it needs more components, it indicates that the complexity of its equipment is higher; On the contrary, it is low. Generally, the circuit fault is defined as the loss of the specified function of the circuit system. View >>

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