Date：2021-11-22 13:15:34

Welding is a process in which the material of the workpiece to be welded (the same or different) is heated or pressurized or both, and the material of the workpiece is bonded between atoms with or without filling materials to form a permanent connection. Welding technology is an important metal processing technology developed at the end of the 19th century and the beginning of the 20th century. Because it has a series of technical and economic advantages, it has developed into an independent discipline and is widely used in aviation, aerospace, atomic energy, chemical industry, shipbuilding, electronic technology, construction, transportation and other industrial departments. View >>

Date：2021-11-22 13:03:36

Nowadays, the volume and weight of electronic products are shrinking, the products are becoming more and more diversified, the technical content is expanding, and the degree of intelligence is greatly improved. The reliability requirements for electronic products have become an important index to measure the quality of electronic products. A large number of various types of electronic components are used in electronic equipment, Equipment failures are mostly caused by the failure or damage of electronic components. Therefore, how to correctly detect electronic components is particularly important, which is also a skill that electronic maintenance personnel must master. View >>

Date：2021-11-22 11:50:00

When selecting solder varieties, we should not only care about the mechanical properties of the solder itself, but also care about the reliability of the welding formed by the solder. In fact, the mechanical properties of solder are not completely equal to those of welding, especially for lead-free welding. The welding formed by solder forms MC at the joint between solder and copper pad. For tin lead solder, the mechanical strength of MC is greater than that of solder itself. When impacted by external force, the fracture usually passes through the solder itself. At this time, large external force impact energy is required. The lead-free welding is different. Under high-speed impact, the fracture will appear at IMC, and with the increase of impact speed, the probability of fracture at IMC will increase, and only low external force impact energy is required. Therefore, people pay more and more attention to lead-free welding View >>

Date：2021-11-19 15:58:00

According to the requirements of the draft technical regulation on the restriction of hazardous substances in RoHS electrical and electronic equipment (notification No. g / TBT / N / Sau / 1166) issued by the Saudi Bureau of standards, measurement and quality (SASO) in December 2020, the content of hazardous substances in all electronic and electronic equipment and devices within the scope must meet the regulatory restrictions before they can be sold in the Saudi market. The final regulation was officially promulgated on July 9, 2021 and will be enforced on January 5, 2022. View >>

Date：2021-11-19 15:24:09

Recently, China National Accreditation Commission for conformity assessment (CNAs) adjusted the management mode of accreditation change. The relevant matters are hereby notified as follows: View >>

Date：2021-11-18 13:40:24

Semiconductor industry is developing rapidly. Semiconductor packaging is a very important link affecting the development of semiconductor industry. The quality of semiconductor packaging technology is a crucial competitive factor. Whether the electronic components are installed incorrectly or not, whether the connector and battery size are in compliance, etc. The application in the semiconductor industry began very early. Driven by the increasing popularity of large-scale integrated circuits in the semiconductor industry, the demand for output and quality in the industry is increasing sharply. Nowadays, in the field of electronic manufacturing, from capacitors, resistors, connectors and other components to PC boards and hard disks, we can almost see the presence of third-party testing institutions in all links of the electronic manufacturing industry chain. View >>

Date：2021-11-18 13:28:49

Product inspection is an essential means of quality control in the production of modern electronic enterprises. It mainly plays the role of process control, quality control and judging the qualification of products. The product inspection shall implement the "three inspection" system combining self inspection, mutual inspection and full-time inspection. View >>

Date：2021-11-17 14:19:43

The primary screening projects and stress conditions carried out by the component manufacturers are difficult to meet the needs of equipment development. The imported components are usually industrial grade or medium and low-grade products, and even fake and shoddy products, which is difficult to ensure the quality and reliability. The inherent reliability of electronic components depends on the reliability design of products. Therefore, we should try to eliminate the problematic components as much as possible before the electronic components are installed on the whole machine or equipment. Therefore, we should screen the components. So, how to screen components? What are the main items? View >>

Date：2021-11-17 14:12:43

Failure analysis (FA) is a post inspection of failed devices. According to the needs, electrical testing and various advanced physical, metallographic and chemical analysis technologies are adopted, and the analysis is carried out in combination with the specific conditions before and after the failure of components and relevant technical documents, so as to verify the reported failure and determine the failure mode, failure mechanism and causes of components and parts View >>

Date：2021-11-16 13:54:47

With the continuous development of intelligent manufacturing technology, the appearance defect detection of most artificial products can be realized through artificial intelligence technology. Due to the disadvantages of slow detection efficiency and low detection accuracy, the visual detection of surface appearance defects can better replace the traditional detection methods. In the production process of electronic components, complex process treatment is required. Under multiple process treatment, various problems will appear, such as surface defects, unclear characters and so on. Any product will produce some poor appearance during production, and electronic components are no exception. So, how to check the appearance quality of electronic components? What are the contents of appearance defect detection of electronic components? View >>