Date：2021-09-10 13:57:00

In fact, the so-called burning is to write code or data inside, which requires specific software and specific hardware, and the data format is generally specific. In the process of chip burning, we will always encounter various problems, large and small. Well, the following are some of the most common problems in the collection of network collation and collection. Engineers will see if they have encountered similar situations. View >>

Date：2021-09-09 15:36:36

Integrated circuit failure analysis plays a vital role in improving the reliability of integrated circuits. Failure analysis of integrated circuits can promote enterprises to correct the problems in the process of design, experiment and production, implement control and improvement measures, prevent and reduce the recurrence of the same failure mode and failure mechanism, and prevent the recurrence of similar failure phenomena. This paper mainly describes the technology and steps of IC failure analysis. View >>

Date：2021-09-09 14:55:39

In the development stage of electronic components, failure analysis can correct errors in design and development and shorten the development cycle; In the production, testing and use stage of electronic components, failure analysis can find out the failure causes of electronic components and the responsible party causing the failure of electronic components. According to the results of failure analysis, the component manufacturer improves the design and production process of components, the user of components improves the circuit board design, improves the testing, test conditions and procedures of components or the whole machine, and even replaces unqualified component suppliers on this basis. Therefore, failure analysis is of great significance to speed up the development of electronic components and improve the yield and reliability of components and the whole machine. View >>

Date：2021-09-09 14:48:00

Failure analysis (FA) is a new developing subject, which has been popularized from military industry to ordinary enterprises in recent years. Generally, according to the failure mode and phenomenon, through analysis and verification, simulate the failure phenomenon, find out the failure cause and mine the failure mechanism. It has strong practical significance in improving product quality, technology development, improvement, product repair, arbitration of failure accidents and so on. The methods are divided into damage analysis, damage analysis, physical analysis, chemical analysis and so on. View >>

Date：2021-09-09 13:26:00

Before failure analysis, it is necessary to narrow the scope of suspicion according to the failed products and their failure background, preliminarily judge the possible failure phenomena of products, select appropriate analysis technology and equipment, follow the principle of simplicity before complexity, from outside to inside, from face to point, from non-destructive to destructive, clarify the analysis sequence and formulate targeted analysis scheme, Reduce the cost of failure analysis, speed up the progress of failure analysis and improve the success rate of failure analysis. Prepare corresponding treatment measures for various possible causes. View >>

Date：2021-09-09 13:16:00

Failure analysis and detection methods of different types of materials: 1 PCB / PCBA failure analysis PCB, as the carrier of various components and the hub of circuit signal transmission, has become the most important and key part of electronic information products. Its quality and reliability level determine the quality and reliability of the whole equipment. View >>

Date：2021-09-08 15:40:00

Generally, the failures of electronic components are called failure. Knowing the failure mode and mechanism of components and the mechanism of equipment failure is very important for diagnosing equipment failure and maintaining the inherent reliability of equipment. The purpose of component failure analysis is not only to judge the failure nature and clarify the failure cause, but also to find an effective way to actively prevent repeated failure. Let's take a look at the main steps of component detection methods and failure analysis. View >>

Date：2021-09-08 15:16:32

Failure analysis is a new developing subject, which has been popularized from military industry to ordinary enterprises in recent years. It is generally based on the failure mode and phenomenon, through analysis and verification, simulate and reproduce the failure phenomenon, find out the cause of failure, and dig out the failure mechanism. Failure analysis is a necessary means to determine the failure mechanism of chip. Failure analysis provides necessary information for effective fault diagnosis. Failure analysis provides necessary feedback information for design engineers to continuously improve or repair the chip design and make it more consistent with the design specification. Failure analysis can evaluate the effectiveness of different test vectors, provide necessary supplements for production testing, and provide necessary information basis for verification and test process optimization. View >>

Date：2021-09-08 11:35:39

Nondestructive testing is to use the acoustic, optical, magnetic and electrical properties of materials to detect whether there are defects or non-uniformity in the tested object without damaging or affecting the service performance of the tested object, and give information such as the size, location, nature and quantity of defects. Nondestructive testing can find defects in the interior and surface of materials or workpieces, measure the geometric characteristics and dimensions of workpieces, and determine the internal composition, structure, physical properties and status of materials or workpieces. What are the characteristics of NDT? What is the principle? View >>

Date：2021-09-08 11:32:36

Casting inspection is the operation process of inspecting whether the casting is qualified by visual inspection, measuring tools, instruments or other means according to the user's requirements, drawing technical conditions and other relevant agreements. Due to the coarse grain, poor sound permeability and low signal-to-noise ratio of the casting, flaw detection will be more difficult. It uses the sound beam with high-frequency sound energy to reflect when it encounters the internal surface or defects. The reflected sound energy is a function of the directivity and nature of the inner surface or defect and the acoustic impedance of this reflector. Therefore, the sound energy reflected by various defects or inner surfaces can be used to detect the location, wall thickness or depth of defects under the surface. View >>