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Screening and testing items for semiconductor discrete device diodes

Date:2024-05-13 17:18:11

The failure of electronic components is mostly caused by various physical and chemical changes inside and on the surface, and whether it is military or civilian products, screening is an important means to ensure reliability. This article will explore the screening testing projects for semiconductor discrete device diodes, aiming to gain a deeper understanding of the importance of these testing projects and their impact on product performance. By conducting precise screening tests, the consistency and reliability of diodes can be ensured, providing a stable foundation for the normal operation of electronic devices. View >>

How does X-Ray and SAT reflect their respective expertise in imaging in different packages?

Date:2024-05-11 11:43:16

What is the difference between ultrasonic scanning SAT and X-Ray? In the same laboratory, SAT and X-ray are complementary methods, and their main difference lies in displaying the characteristics of the sample. X-ray can observe the interior of the sample, mainly based on differences in material density. X-Ray is not very sensitive to stratified air, and cracks and solder joints are difficult to observe through X-Ray unless the material has sufficient physical separation. View >>

Exploring the Types, Effects, and Placement Requirements of High and Low Temperature Environmental Tests

Date:2024-05-11 11:00:00

High and low temperature environmental testing is a common testing method used to evaluate the performance and reliability of products under extreme temperature conditions. This type of test can help manufacturers determine the suitability of products in extremely cold or hot environments, and identify potential issues and design defects. This article will introduce the types, effects, and placement requirements of high and low temperature environmental tests. View >>

Key methods to ensure chip performance reliability

Date:2024-05-10 13:32:22

In today's high-tech era, chips have become the core of almost all electronic devices. As the complexity of chips continues to increase, ensuring the reliability of their performance has become a key issue. Below, we will explore several important methods to ensure the reliability of chip performance. View >>

Precautions for operating high and low temperature impact test chambers

Date:2024-05-10 13:32:17

The cold and hot impact test chamber (also known as the high and low temperature impact test chamber) is a device used to test the tolerance of products. By constantly changing the temperature, it detects whether the product is damaged. The thermal and cooling effects generated will simulate climate change in various extreme scenarios. During the development phase, it can be used to detect product design and process defects, as well as for environmental stress screening, to eliminate early product failures. The severity of the test depends on factors such as high and low temperature range, residence time, temperature conversion time, and number of cycles. So what should be noted when using a high and low temperature impact test chamber? View >>

Accelerated Life Testing: Key Assessment of Product Reliability

Date:2024-05-09 14:58:55

HAST high acceleration life testing is an important tool for evaluating product reliability by simulating harsh environmental conditions. This testing method accelerates the aging process of products by applying high temperature, high humidity, and high pressure conditions, thereby detecting the performance and durability of products in a short period of time. In today's fiercely competitive market, product reliability has become an important factor in consumer choice. Therefore, HAST high acceleration life testing has become an indispensable testing method in many industries. View >>

Key points of cold and hot shock testing for IGBT chips

Date:2024-05-08 13:58:50

In the field of power electronics, IGBT (Insulated Gate Bipolar Transistor) chips play a crucial role and are widely used in various power electronic devices. In order to ensure the reliability and stability of IGBT chips, strict testing is required in their design and manufacturing process, among which cold and hot shock testing is one of the crucial steps. The cold and hot shock test aims to simulate the extreme temperature changes that IGBT chips may encounter in practical applications, in order to evaluate their performance and reliability under various environmental conditions. View >>

The Process Steps of HAST High Acceleration Life Test

Date:2024-05-08 13:58:35

HAST high acceleration life test is a testing method that achieves accelerated aging of products by applying high temperature, high humidity, and high pressure to the sample. Widely used in industries such as PCB, IC semiconductor, connectors, circuit boards, magnetic materials, polymer materials, EVA, photovoltaic modules, etc. for accelerated aging life testing, to evaluate product sealing, moisture absorption, and aging performance. View >>

Analysis of the current status and necessity of testing automotive grade chips

Date:2024-05-07 15:15:52

As a product that integrates advanced mechanical and electronic technology, the safety, stability, and reliability of automobiles are undoubtedly the core elements. Car grade chips, as the "heart" of cars, their performance directly affects the overall performance of the car. Therefore, conducting comprehensive and rigorous testing of automotive grade chips is not only a necessary means to ensure car quality, but also a key link in ensuring driving safety. View >>

Why is it necessary to use X-ray inspection equipment to detect IC chips?

Date:2024-05-07 15:15:43

With the rapid development of information technology, integrated circuit (IC) chips have become the core components of modern technological products, and their performance, quality, and reliability directly affect the operational effectiveness of the entire system. Due to the trend of miniaturization and complexity in IC chips, traditional detection methods are no longer able to meet the precise identification requirements for internal structures and defects. At this time, X-ray detection equipment has emerged as a non-destructive and efficient detection technology, becoming an important tool for quality control of IC chips. View >>

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