Date：2024-01-19 17:23:31

BGA (Ball Grid Array) is a common packaging method for electronic components, and its welding quality directly affects the performance and reliability of electronic products. Virtual soldering is a common defect in BGA welding process, which can lead to poor contact between solder joints and pads, thereby affecting the electrical performance and mechanical strength of the product. This article will introduce the causes and control methods of BGA virtual soldering, helping readers better understand and solve related problems. View >>

Date：2024-01-18 13:50:55

Cold and hot shock testing, also known as temperature shock, heat shock testing, etc., simulates the testing of samples in environments with drastic temperature changes or alternating high and low temperatures. Electronic products often encounter temperature changes during use, such as rapid transitions between high and low temperatures and temperature changes. These temperature changes may have an impact on the performance and reliability of electronic products, so it is necessary to conduct cold and hot shock tests on electronic products. This article will introduce the principles and standard specifications of cold and hot shock in electronic products. View >>

Date：2024-01-18 13:50:43

BGA solder ball welding is a common connection method in electronic manufacturing, but adverse phenomena may occur during the welding process, which can affect the performance and reliability of electronic products. This article will introduce several common methods for determining the welding defects of BGA solder balls, to help readers better understand and solve related problems. View >>

Date：2023-10-19 17:18:24

Scanning Electron Microscopy (SEM) is a high-resolution microscopy technique that uses signals generated by the interaction between an electron beam and a sample to observe the morphology, structure, and composition of the sample surface. This article will introduce the principles and applications of scanning electron microscopy. View >>

Date：2023-10-19 17:18:09

Moisture sensitive devices refer to electronic components packaged with hygroscopic materials such as epoxy resin, polymer resin, etc. Moisture sensitivity level (referred to as MSL in the electronics industry) is defined as the maximum safe time a component can be exposed to an environment not higher than 30 ° C and 60-85% relative humidity for reflow soldering processes. This range starts from MSL 1 and is referred to as "unrestricted" or unaffected, with each incremental level representing a duration threshold. View >>

Date：2023-10-18 16:54:23

The quality of solder joints is crucial for determining the reliability and performance of SMT components, and the quality of BGA solder joints should be crucial. Therefore, it is crucial to take effective measures to ensure the quality of BGA components' solder joints and achieve the ultimate reliability of SMT components. This article will introduce common methods for BGA welding quality inspection. View >>

Date：2023-10-18 16:54:12

DPA (Destructive Physical Analysis) detection of components is a method of determining the cause and mechanism of failure through physical analysis of components. In the manufacturing and maintenance process of electronic products, the failure of components may lead to the failure of the entire circuit, affecting the performance and reliability of the entire electronic product. Therefore, DPA detection of components is particularly important. View >>

Date：2023-10-17 14:42:50

BGA welding is a critical process in PCBA processing. However, due to the relative difficulty of inspection and maintenance after BGA welding, X-ray fluoroscopy must be used to ensure the reliability of the welding connection. Therefore, in PCBA processing, it is crucial to diagnose the defects in BGA welding, especially during reflow welding. This article will introduce the judgment method and handling of BGA welding defects. View >>

Date：2023-10-17 14:42:42

Structural analysis of electronic components is a method of analyzing the internal structure of components to determine whether their structure meets design requirements. When conducting structural analysis, special tools and techniques are needed to comprehensively understand the structure of components. The following is a detailed introduction to the structural analysis of electronic components. View >>

Date：2023-09-28 15:46:08

Electronic components are the core components of electronic products, and their quality and performance directly affect the quality and performance of products. To ensure the quality and reliability of electronic products, it is necessary to inspect and screen electronic components. This article will discuss this topic and introduce how to inspect and screen electronic components. View >>