Date：2023-09-27 14:27:10

IC chips are the core components in electronic products, and their quality and authenticity directly affect the performance and reliability of products. In China, there are various methods that can be used to identify the authenticity of IC chips. This article summarizes some information and hopes to provide valuable references for readers. View >>

Date：2023-09-27 14:26:16

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Date：2023-09-26 14:03:54

Constant humidity heat test is a common testing method used to evaluate the durability and stability of materials under high humidity and high temperature conditions. This test can simulate high humidity and heat conditions in real environments, such as tropical and subtropical climates, as well as certain industrial and laboratory environments. This article summarizes some materials and hopes to provide valuable references for readers. View >>

Date：2023-09-26 14:03:44

With the widespread application of the Internet of Things and intelligent devices, data security and privacy protection are increasingly being valued. To ensure the security of devices, manufacturers need to take various measures to protect their devices from malicious attacks. Among them, DPA detection of components is a very important technology that can help manufacturers detect potential vulnerabilities and security risks in their equipment. So, what equipment is required for DPA detection of components? View >>

Date：2023-09-25 17:35:48

Damp heat test is a common environmental test used to evaluate the durability and stability of materials and equipment under high temperature and humidity conditions. In the damp heat test, the sample is exposed to a high-temperature and high humidity environment to simulate the high-temperature and high humidity environment that may be encountered in actual production and use, in order to evaluate the performance and reliability of materials and equipment. Common damp heat tests include constant temperature and humidity tests, cyclic damp heat tests, salt spray tests, etc. View >>

Date：2023-09-25 17:35:32

DPA (Destructive Physical Analysis) detection and analysis of electronic components is a method of determining the cause and mechanism of failure through physical analysis of electronic components. In modern electronic products, electronic components are the basic components that make up a circuit, and their failure will lead to the failure of the entire circuit, thereby affecting the performance and reliability of the entire electronic product. Therefore, failure analysis and non-destructive testing of electronic components are particularly important. View >>

Date：2023-09-22 15:58:41

Damp heat test is a method used to test the resistance of materials, products, and equipment to damp heat environments. In the damp heat test, the sample will be exposed to a high temperature and humidity environment to simulate the humid heat environment under actual application conditions. The wet heat test of components can be used to evaluate the durability, reliability, and lifespan of components, which is of great significance for the design and manufacturing of electronic products. View >>

Date：2023-09-22 15:58:37

DPA (Destructive Physical Analysis) detection of electronic components is a method of determining the cause and mechanism of failure through physical analysis of electronic components. Unlike conducting DPA attacks on the entire encryption device, component DPA detection focuses on analyzing the power consumption changes of individual electronic components. The following is a detailed introduction to the DPA testing standards for electronic components. View >>

Date：2023-09-21 14:03:00

Component DPA detection is a DPA attack and defense method targeting a single electronic component. It can help manufacturers detect potential vulnerabilities and security risks in their equipment, thereby improving the security and reliability of the equipment. This article has collected and organized some materials, hoping to have significant reference value for readers. View >>

Date：2023-09-21 14:00:00

X-ray inspection of solder joints in electronic components is an important step in the production and maintenance process of electronic products, which can be used to detect the quality and reliability of solder joints. When conducting X-ray inspection of solder joints in electronic components, certain standards and specifications need to be followed to ensure the accuracy and reliability of the inspection results. To help everyone gain a deeper understanding, the following content is organized by Chuangxin Testing Network and provided for your reference. View >>