Date：2023-09-14 16:08:06

Mechanical impact testing is a testing method that tests the tolerance and stability of a mechanical system when subjected to sudden stops or changes in direction of impact. In mechanical impact testing, detection standards are very important as they can ensure the accuracy and reliability of test results, as well as the safety and stability of the testing process. The following will provide a detailed introduction to the detection standards for mechanical impact testing. View >>

Date：2023-09-13 14:21:49

Mechanical impact waveform refers to the waveform generated by mechanical impact, which is caused by the wave generated by the instantaneous action of mechanical impact force on the surface of an object. If you are interested in the upcoming content, please continue reading the following text, hoping it can be helpful to you. View >>

Date：2023-09-13 14:21:38

Wire bonding technology is a technology that welds microelectronic device leads and chip leads together. There are many materials available for wire bonding, and the selection of appropriate materials depends on the specific application requirements and cost considerations. In the process of wire bonding, the materials used directly affect the quality and reliability of the solder joints. If you want to gain a deeper understanding of wire bonding materials, this article will summarize relevant knowledge and provide you with a comprehensive understanding and understanding. View >>

Date：2023-09-12 15:22:03

The mechanical impact of electronic devices refers to the sudden impact force received during the transportation, storage, and use of electronic devices. This impact force may cause damage or failure of electronic devices, thereby affecting the performance and reliability of electronic devices. To help everyone gain a deeper understanding, the following content is organized by Chuangxin Testing Network and provided for your reference. View >>

Date：2023-09-12 15:21:53

Wire bonding is commonly used for packaging micro electronic components such as IC chips, LEDs, MEMS, etc. It is a method of soldering metal wires (usually gold wires) between chips and pins to transmit signals and electricity. This article mainly introduces the principle and process technology of wire bonding. View >>

Date：2023-09-01 16:07:00

In mechanical impact testing, parameters such as vibration, displacement, stress, and deformation of the mechanical system after being impacted are usually measured to evaluate the tolerance and stability of the mechanical system. At the same time, it is also possible to observe whether there are cracks, deformations, fractures, and other phenomena in the components and structures of the mechanical system, in order to evaluate the safety and reliability of the mechanical system. The purpose and significance of mechanical impact testing will be introduced in detail below. View >>

Date：2023-09-01 16:07:00

Wire bonding strength testing is a method of evaluating the reliability of wire bonding connections. This test is usually conducted using a shear tester to measure the shear strength and shear force of wire bonding. In order to conduct wire bonding strength testing, specialized testing tools are required. The following is an introduction to the wire bonding strength testing tool. View >>

Date：2023-08-31 15:42:00

Mechanical impact refers to the phenomenon of sudden stop or change of direction during mechanical movement, causing instantaneous impact and vibration of components in the mechanical system, thereby causing damage to the mechanical system or affecting its normal operation. Mechanical shock and vibration are two different physical phenomena that have different applications and meanings in the field of mechanical engineering. The following will provide a detailed introduction to the differences between mechanical shock and vibration. View >>

Date：2023-08-31 15:42:00

Wire bonding tensile test is one of the common wire bonding strength testing methods, which can be used to test the tensile strength and breaking force of wire bonding connections. In wire bonding tensile testing, a tensile tester is usually used for testing. This article summarizes some materials and hopes to provide valuable references for readers. View >>

Date：2023-08-30 16:45:00

Mechanical impact and vibration testing are commonly used testing methods, which can be used to test the impact resistance and durability of objects. However, their scope of application is different. The following will introduce the applicability and differences of mechanical impact and vibration testing. View >>